Сведения о компании

  • Shenzhen Bente Circuit Limited

  •  [Guangdong,China]
  • Деловой Тип :Дистрибьютор / Оптовый Торговец , производитель , обслуживание
  • Main Mark: Северные и Южная Америка , карибский , Восточная Европа , Европа , Северная Европа , Океания , Западная Европа , Африка , Азия , средний Восток , Другие рынки , Мировой
  • Экспортер:91% - 100%
  • Certs:ISO9001, ISO14001, RoHS, ISO/TS16949, UL
  • Описание:HDI PCB ENIG PCB Assembly,HDI PCB FR4 PCB Assembly,HDI PCB BGA PCB Assembly
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Shenzhen Bente Circuit Limited

HDI PCB ENIG PCB Assembly,HDI PCB FR4 PCB Assembly,HDI PCB BGA PCB Assembly

Главная > Перечень Продуктов > HDI PCB > 8 Layers HDI PCB FR4 Tg170 ENIG 3U" BGA Buried/Blind Hole

8 Layers HDI PCB FR4 Tg170 ENIG 3U" BGA Buried/Blind Hole

Поделиться с:  
    Вид оплаты: L/C,T/T,D/P,Paypal,Money Gram,Western Union
    Incoterm: FOB,CFR,CIF,FCA,CPT,CIP
    Количество минимального заказа: 1 Piece/Pieces
    Срок поставки: 5 дней

Базовая информация

Тип: Жесткая печатная плата

диэлектрический: FR-4

Базовый материал: медь

Механическая Жесткая: жесткий

Category: HDI PCB

Layers: 8 Layers

Material: FR4,Tg170

Thickness: 1.6mm±0.13mm

Surface Treatment: ENIG 3U"

Finished Copper: 1oz

Min.Line Width/Space: 5/5mil

Minimum Hole: 0.25mm

Hole Copper: 25um

Technical Features: Minimum PAD Of BGA Is 0.2mm, 5 BGA/PCS, Buried/Bli

Огнезащитные свойства: V0

Изоляционные материалы: Органическая смола

Технология обработки: Электролитическая фольга

заявка: Медицинские инструменты

материал: Бумажная фенольная медная подложка из фольги

марка: JC

Additional Info

Подробности Упаковки: Vacuum-Packed

производительность: 10000

марка: BentePCB

транспорт: Ocean,Land,Air

Место происхождения: China

Сертификаты : ISO 9001

Описание продукта

Product Description:

What is PCB design, circuit prototyping, PCB free, PCB quote, PCB prototype service, PCB products, etching circuit boards, making a circuit board, circuit board tester,pc board assembly.
8 Layers HDI PCB, Buried/Blind Hole, Bare board. Base Material is FR4 Tg170. Board Thickness is 1.6mm±0.13mm. Surface Treatment is ENIG 3U" . Technical Features is Minimum PAD of BGA is 0.2mm, 5 BGA/PCS, Buried/Blind Hole.
Ship by DHL, FEDEX, UPS, TNT or client specified.  Pay with popular and secure payment methods, such as PayPal, Telegraphic Transfer, etc.  Our PCB products are mainly used in these fields: Power Electronics, Communications, Industrial Control, Medical Electronics, Security Electronics, Consumer Electronics, Computer, Automotive Electronics, etc. 

HDI PCB:

High Density Interconnects (HDI) are used to meet the market demand for complex designs in smaller form factors across the majority of market segments, (Wireless, Telecom, Military, Medical, Semiconductor, and Instrumentation).

HDI Circuit boards, one of the fastest growing technologies in PCBs, HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.

They have finer lines and spaces always = <3mil They have a higher circuitry density than traditional circuit boards.

Andwin maintains years of experience with HDI products and was a pioneer of second generation microvias. now offer an entire family of microvia technology solutions for your next generation products.

Stack up of HDI PCB

Stack up of 1  Step HDI PCB

Stack up of 1 Step HDI PCB

Stack up of 2 step HDI PCB

Stack up of 2 step HDI PCB

Stack up of  2 steps HDI with blind via and buried via

 Stack up of 2 steps HDI with blind via and buried via

Anylayer connect of HDI PCB, need to adjust drill

Anylayer connect of HDI PCB, need to adjust drill


About Us:

BentePCB is a professional PCB manufacturing which is focus on double side, multilayer, HDI PCB, rigid PCB and flexible PCB mass production. The company was established on 2011.
We have two factories together, The factory in Shenzhen is specialized in small and middle volume orders and the factory in Jiangxi is for big volume.

Why Us?

UL (E492586), ISO9001,  ISO14001, TS16949, RoHS certified.
Turnover USD 
10-50 million per year.
15,000 sqm area, 450 staff .
Mass Production from single to 
16 layers.
Special Material:
ROGERS, Arlon, Taconic.etc.
Client:
Huawei, SAMSUNG, Malata, Midea,Texas Instruments.etc.


Certification(UL:E492586, TS16949, ISO14001, ISO9001,RoHS):

ISO9001,ISO14001UL:E492586

Factory Tour:

PCB Manufacturer

PCB Factory

PCB Manufacturing

Exhibition:

We Took part in the famous exhibitions over the past years,and got highly appreciation from the top experts,as well as cooperated tightly with them.

Exhibition

Delivery:

BentePCB offers flexible shipping methods for our customers, you may choose from one of the methods below.
Delivery

PCB China

We don`t just sell PCBs .We sell sleep.

Contact Us

Группа Продуктов : HDI PCB

изображение Продукта
  • 8 Layers HDI PCB FR4 Tg170 ENIG 3U" BGA Buried/Blind Hole
  • 8 Layers HDI PCB FR4 Tg170 ENIG 3U" BGA Buried/Blind Hole
  • 8 Layers HDI PCB FR4 Tg170 ENIG 3U" BGA Buried/Blind Hole
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